Product List
| Title | Chemical Name | Key Attribute 1 | Key Attribute 2 | |
|---|---|---|---|---|
| Reaxis C154 | Stannous Chloride, Dihydrate | No Key Attribute | No Key Attribute | |
| Reaxis C162 | Stannous Chloride, Anhydrous | No Key Attribute | No Key Attribute | |
| Reaxis C188 | Stannous Oxide | No Key Attribute | No Key Attribute | |
| Reaxis C719 | Bismuth Methanesulfonate Solution | No Key Attribute | No Key Attribute | |
| Reaxis E140 | Potassium Stannate | No Key Attribute | No Key Attribute | |
| Reaxis E140P | Potassium Stannate, Peroxide Grade | No Key Attribute | No Key Attribute | |
| Reaxis E144 | Sodium Stannate | No Key Attribute | No Key Attribute | |
| Reaxis E144P | Sodium Stannate, Peroxide Grade | No Key Attribute | No Key Attribute | |
| Reaxis E155 | Stannous Sulfate Crystal | No Key Attribute | No Key Attribute | |
| Reaxis S25 | Stannous Chloride Dihydrate | No Key Attribute | No Key Attribute | |
| Reaxis S45 | Stannous Chloride Dihydrate | No Key Attribute | No Key Attribute | |
| Reaxis S50 | Stannous Chloride Solution | No Key Attribute | No Key Attribute | |
| Reaxis S72 | Stannous Chloride Solution | No Key Attribute | No Key Attribute |
Potassium Stannate
Potassium stannate is a white crystalline compound with the chemical formula K2O3Sn. It is an effective reducing agent in the electroplating of tin onto metal surfaces. During the electroplating process, tin ions are reduced onto the surface of the metal, forming a uniform coating that protects the surface from corrosion and oxidation. Potassium stannate plays a critical role in this process by providing the electrons necessary for the reduction reaction to occur. In addition to its use as a reducing agent, potassium stannate can also be used as a stabilizer for electroless nickel plating baths. Electroless nickel plating is a process that deposits a layer of nickel onto a substrate without using an external electrical source. The plating solution typically contains nickel ions, reducing agents, and stabilizers. The role of the stabilizer is to prevent the precipitation of nickel ions, which can negatively impact the plating process. Potassium stannate is an effective stabilizer in this process, as it can complex with nickel ions to prevent precipitation.
Sodium Stannate
Sodium stannate is another white crystalline compound, with the chemical formula Na2SnO3. Like potassium stannate, it is commonly used as a reducing agent in the electroplating of tin onto metal surfaces. During the electroplating process, sodium stannate provides electrons to the tin ions, allowing them to reduce onto the metal surface and form a uniform coating. This coating provides the metal with enhanced resistance to corrosion and oxidation. Much like potassium stannate, sodium stannate is also commonly used as a stabilizer in electroless nickel plating baths. Sodium stannate is an effective stabilizer due to its ability to complex with nickel ions and prevent precipitation.
Stannous Sulfate Crystal
Stannous sulfate crystal is another important reducing agent used in the manufacturing industry for electroplating processes. It helps to promote the deposition of metal ions onto the surface of metal substrates, resulting in improved adhesion and durability of the coating. This tin compound plays a critical role in electroplating baths for the deposition of tin and other metals onto metal surfaces. During the electroplating process, stannous sulfate crystal acts as a reducing agent by donating electrons to the metal ions in the plating solution. This reduction reaction leads to the deposition of a uniform metal coating onto the substrate.
For all your plating agent needs, Reaxis has you covered. Learn more about each of our plating agents and request specialty chemical samples of each on their respective pages. If you have any questions or concerns, feel free to contact us!
